Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
Results showed that the polishing effect was improved in alkaline bath with PEG as brightener, and the use time of bath was prolonged with sodium tartrate as stabilizer.
试验表明，采用此工艺来抛光铝材获得的综合效果优于酸性电化学抛光和传统碱性电化学抛光，是一项有应用前景的新工艺。
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